35th International Symposium for Testing and Failure Analysis (November 15-19, 2009): Failure Analysis of Stacked-Die Devices by Combining Non-Destructive Localization- and Target Preparation Methods

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Failure Analysis of Stacked-Die Devices by Combining Non-Destructive Localization- and Target Preparation Methods

Thursday, November 19, 2009: 10:15 AM
Meeting Room J1-J2 (San Jose McEnery Convention Center)
Mr. Christian Schmidt , Fraunhofer Institute for Mechanics of Materials, Halle, Germany
Michél Simon , Fraunhofer Institute for Mechanics of Materials, Halle, Germany
Frank Altmann , Fraunhofer Institute for Mechanics of Materials, Halle, Germany
Antoine Nowodzinski , CEA-LETI Minatec, Grenoble Cedex 9, France
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