35th International Symposium for Testing and Failure Analysis (November 15-19, 2009): Global Die Ultra-Thin Silicon for Backside Diagnostics and Circuit Edit

Global Die Ultra-Thin Silicon for Backside Diagnostics and Circuit Edit

Wednesday, November 18, 2009: 8:00 AM

Meeting Room J1-J2 (San Jose McEnery Convention Center)

Ms. Erin O'Donnell , Intel Corporation, Folsom, CA

Mr. Dane Scott , Intel Corporation, Folsom, CA

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