35th International Symposium for Testing and Failure Analysis (November 15-19, 2009): Session 4: Circuit-Edit

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Session 4: Circuit-Edit

Wednesday, November 18, 2009: 8:00 AM-9:40 AM
Meeting Room J1-J2 (San Jose McEnery Convention Center)
Session Chairs:
Mr. Ted Lundquist and Ryan Ross
8:00 AM
Global Die Ultra-Thin Silicon for Backside Diagnostics and Circuit Edit
Ms. Erin O'Donnell, Intel Corporation; Mr. Dane Scott, Intel Corporation
8:25 AM
Methods for Quantifying FIB Milling Acuity
Dr. Chad Rue, FEI Company
8:50 AM
Novel Dielectric Etch Chemistry for the Next Generation of Circuit Edit: Delicate to Low-k Dielectrics and Silicon
Dr. Vladimir V. Makarov, Tiza Lab, LLC; Leo Krasnobayev, Tiza Lab, LLC
9:15 AM
A Versatile Design of Solid Immersion Lenses in Bulk Silicon Using Focused Ion Beam Techniques
Mr. Philipp Scholz, Berlin University of Technology; Uwe Kerst, Berlin University of Technology; Christian Boit, Berlin University of Technology; Chun-Cheng Tsao, DCG Systems; Ted Lundquist, DCG Systems
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