35th International Symposium for Testing and Failure Analysis (November 15-19, 2009): Decapsulation Techniques for Cu Wire Bonding Package

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Decapsulation Techniques for Cu Wire Bonding Package

Wednesday, November 18, 2009
Exhibit Hall 3 (San Jose McEnery Convention Center)
Dr. Dongmei Meng , LSI, Fort Collins, CO
Joe Rupley , LSI, Fort Collins, CO
Chris McMahon , LSI, Fort Collins, CO
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