35th International Symposium for Testing and Failure Analysis (November 15-19, 2009): Conductive Filament Formation in Printed Circuit Boards – Effects of Reflow Conditions and Flame Retardants

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Conductive Filament Formation in Printed Circuit Boards – Effects of Reflow Conditions and Flame Retardants

Thursday, November 19, 2009: 8:50 AM
Meeting Room J3 (San Jose McEnery Convention Center)
Mr. Bhanu P. Sood , CALCE, University of Maryland, College Park, MD
Michael Pecht , CALCE, University of Maryland, College Park, MD
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See more of: Session 9: Package and Assembly Level FA
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