35th International Symposium for Testing and Failure Analysis (November 15-19, 2009): Subsurface Imaging of Multi-Level Integrated Circuits Using Scanning Electron Acoustic Microscopy

Subsurface Imaging of Multi-Level Integrated Circuits Using Scanning Electron Acoustic Microscopy

Tuesday, November 17, 2009: 11:15 AM
Meeting Room J1-J2 (San Jose McEnery Convention Center)
Ms. Lei Meng , Centre for Integrated Circuit Failure Analysis and Reliability (CICFAR), National University of Singapore, Singapore, Singapore
Mr. Alan G. Street , QUALCOMM, Inc, San Diego, CA
Prof. J.C.H. Phang , Centre for Integrated Circuit Failure Analysis and Reliability (CICFAR), National University of Singapore, Singapore, Singapore
See more of: Session 1: Emerging Concepts
See more of: Symposium