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Tuesday, November 16, 2010 - 4:05 PM
6.1

A Novel Wet Etch in-Situ Decapsulation of Devices On Boards

M. A. Gonzales, J. Kiljan, Qualcomm, Inc., San Diego, CA

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Summary: This presentation is a technique that takes advantage of an UV quick cure product that is very chemical resistant, has excellent adhesion yet is easily peeled off. The protection it provides is versatile and efficient as well as effective.