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| Session 6: Sample Prep for Chip Access and Device Deprocessing | ||||
| Location: Lalique Ballroom (InterContinental Hotel Dallas) | ||||
| (Please check final room assignments on-site). | ||||
| Session Description: Without accurate, non-destructive sample preparation, the majority of expensive, high-resolution instruments in our labs would be useless. A wide variety of techniques have been developed to ensure non-destructive die access and accurate physical failure location. This session covers methods dealing with everything from packages to through-wafer vias to transistors to repackaging for electrical test. Topics for discussion can include:
• Decapping methods
• Delayering methods
• Novel mechanical sectioning techniques
• New etch techniques (wet and dry)
• Ion milling
• Techniques for new materials
• Re-packaging techniques
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| Session Chairs: | Ms. Becky Holdford Texas Instruments, Dallas, TX Mr. Robert Champaign Raytheon Network Centric Systems, McKinney, TX | |||
| 4:05 PM | 6.1 | A Novel Wet Etch in-Situ Decapsulation of Devices On Boards | ||
| 4:30 PM | 6.2 | Low Temperature Plasma Decapsulation of Copper-Wire-Bonded and Exposed Copper Metallization Devices | ||
| 4:55 PM | 6.3 | Decapsulation of Copper Bonded Plastic Encapsulated Integrated Circuits Utilizing Laser Ablation and Mixed Acid Chemistry | ||