P. Jacob, I. Jerjen, G. Nicoletti, EMPA Swiss Federal Laboratories for Materials Testing and Research, Duebendorf, Switzerland

Summary: The paper describes the investigations and root cause findings of LPCMOS device stitch bond shearing by means of XrayComputer Tomography (XCT), metallographical polishing and FIB investigation. Stitch bond shearing increased significantly with the introduction of lead-free soldering and becomes also a main failure issue for multi-chip-module packaging techniques