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| Session 20: Packaging and Assembly Level FA II | ||||
| Location: Lalique Ballroom (InterContinental Hotel Dallas) | ||||
| (Please check final room assignments on-site). | ||||
| Session Description: | ||||
| Session Chairs: | Dr. James J. Demarest IBM, Albany, NY Ms. Carol Boye IBM, Albany, NY | |||
| 3:35 PM | 20.1 | Root-Cause Investigations of Stitchbond – Shearing by Means of 3D-X-Ray Computer Tomography (XCT), Metallographical Polishing and FIB | ||
| 4:00 PM | 20.2 | Methodology for Analysis of Schottky Diode Failures | ||
| 4:25 PM | 20.3 | Resolving the Failure Analysis Challenges On Stack Die Structure in Lead Frame Chip Scale Package (LFCSP) | ||