T. Malik, R. K. Jain, DCG Systems Inc., Fremont, CA; F. Meijer, T. Velthof, MASER Engineering, Enschede, Netherlands

Summary: Planner etching of a thick Cu plane has been very challenging for FIB circuit edit. Maintaining planarity during Cu removal is essential to reliable lower metallization edits and can be the deciding factor between success and failure. Presenting a FIB scanning recipe combined with a widely used halogen chemistry in the system to enable robust bulk Cu milling for circuit edit.