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| Session 19: Circuit Edit II (Laser, FIB, etc.) | ||||
| Location: Malachite Showroom (InterContinental Hotel Dallas) | ||||
| (Please check final room assignments on-site). | ||||
| Session Description: Traditionally Circuit Edit (CE) of integrated circuits has been done with focused ion beams (FIBs), but the first proposal to do CE suggested electron beams. Laser beams have also been used for CE, especially for long depositions. So far, focused ions beams are dominating CE, but moving forward with the race to fulfill Moore’s Law, FIB may be challenged at the “bleeding edge” by other technologies because CE becomes increasingly difficult at each new process node. With regards to novel applications, there has been recent interest to apply CE for fine tuning photonics. The number one application that drives CE tool purchases has been validating a design or even a mask ECO before a mask respin, because the value of CE keeps increasing as the cost of mask changes increases. Papers in this session will cover various novel processes and applications of CE to deliver more value to its users. | ||||
| Session Chairs: | Mr. Ted R. Lundquist DCG Systems, Inc, Freemont, CA Mr. Michael W. Phaneuf Fibics Incorporated, Ottawa, ON, Canada | |||
| 1:55 PM | 19.1 | Pulsed Spot Milling and Deposition to Enable Next Generation Circuit Edit Via Development | ||
| 2:20 PM | 19.2 | Novel Circuit Edit Solution for Bulk Cu Milling | ||
| 2:45 PM | 19.3 | Fast Mixed Field Material Removal Using New Dielectric Etch Solution | ||