J. Walter, S. Martens, W. Mack, Infineon Technologies AG, Regensburg, Germany

Summary: The trend towards 3D integration in Microsystems Technology and electronic packaging requires that failure analysis methods and target preparation procedures are adapted to these emerging packaging technologies. The feasibility of laser target preparation in Microsystems is addressed in this paper, especially 3D integrated electronic devices. Various laser technologies were evaluated and the laser of choice was moreover proven regarding stacked packages behaviour and the dimension of Heat-Affected Zones (HAZs). The laser energy absorption was determined by in situ heating rate measurement, which enables the precise HAZ prediction by the use of Finite Element (FE) simulation. The advantage in removal rates compared to conventional techniques is discussed, as well as the combination of the excellent ablation rates of pulsed-laser ablation with the high accuracy of (Focused Ion Beam) FIB milling.