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| Session 12: MEMS, Discretes and Optoelectronic Device FA | ||||
| Location: Malachite Showroom (InterContinental Hotel Dallas) | ||||
| (Please check final room assignments on-site). | ||||
| Session Description: | ||||
| Session Chairs: | Mr. Jim Colvin FA Instruments, San Jose, CA Mr. David L. Burgess Accelerated Analysis, Half Moon Bay, CA | |||
| 3:10 PM | 13.1 | Characterization of Green and Ultraviolet LEDs by Laser-Based FA Techniques | ||
| 3:35 PM | 13.2 | Advanced Laser Preparation of Microsystems for Further FIB Processing | ||
| 4:00 PM | 13.3 | Fast Turn-around Failure Analysis of Metal Interconnection Using FIB and LA ICP-MS | ||
| 4:25 PM | 13.4 | A Novel Non-Destructive Approach to Deprocess the Sealing Cap From MEMS Device for Failure Analysis | ||
| 4:50 PM | 13.5 | A Novel Technique for Localization of Low Level Leakage in Integrated Circuits | ||