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Thursday, November 18, 2010 - 2:45 PM
19.3
Fast Mixed Field Material Removal Using New Dielectric Etch Solution
V. V. Makarov, L. Krasnobayev, Tiza Lab, LLC, Milpitas, CA
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Summary:
A method is proposed to remove mixed field materials (dummies/dielectric) to access a metal line of interest using new dielectric etch chemical solution for circuit edit