Microwave Induced Plasma Etching for Decapsulation of Copper Wire Bonded IC Packages

Tuesday, November 13, 2012: 6:45 PM
Fridays Front Row (Phoenix Convention Center)
Mr. J. Tang , Delft University of Technology, Delft, Netherlands
Mr. J.B.J. Schelen , Delft University of Technology, Delft, Netherlands
Prof. C.I.M. Beenakker , Delft University of Technology, Delft, Netherlands
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