38th International Symposium for Testing and Failure Analysis: At-A-Glance

	SUNDAY November 11		MONDAY November 12		TUESDAY November 13		WEDNESDAY November 14		THURSDAY November 15
	AM	PM	AM	PM	AM	PM	AM	PM	AM	PM
Symposium			ISTFA 2012 Opening Session 8:00 AM-9:40 AM Session 1: Emerging Concepts and Techniques 9:55 AM-12:25 PM	Session 2: Fault Isolation and Failure Analysis of TSV 1:25 PM-3:05 PM Session 3: Nanoprobing Techniques 1:25 PM-3:05 PM Session 4: Fault Isolation and Failure Analysis of 3D Packages 3:20 PM-4:35 PM Session 5: Nanoprobing Applications 3:20 PM-4:35 PM Nanoprobing User Group 4:35 PM-6:00 PM Panel Discussion 4:35 PM-6:00 PM	Session 6: Photon Based Techniques: An Understanding 8:00 AM-9:40 AM Session 7: Rethinking the FA Process 8:00 AM-9:40 AM Expo Show Floor 9:30 AM-5:30 PM Session 8: Photon Based Techniques: One Step Beyond 9:55 AM-11:35 AM Session 9: Technology Specific Case Studies 9:55 AM-11:35 AM	Session 11: Alternative Energy 1:05 PM-2:20 PM Session 10: Photon Based Techniques: More Applications 1:05 PM-2:45 PM Session 13: Defect Analysis 3:00 PM-4:15 PM Session 12: Improving Fault Isolation with Software 3:00 PM-4:40 PM Contactless Fault Isolation User Group 4:40 PM-5:40 PM	FIB Tutorial 8:00 AM-9:00 AM Session 14: Packaging and Assembly Analysis 8:00 AM-10:05 AM Microscopy II Tutorial 9:00 AM-10:00 AM Expo Show Floor 9:30 AM-4:00 PM Session 16: Case Studies I 10:20 AM-11:35 AM Session 15: TEM Defect Detection 10:20 AM-12:00 PM	EDFAS General Membership Meeting & Networking Luncheon 12:00 PM-1:30 PM Session 24: Exhibitor Dessert Reception and Poster Session 1:30 PM-3:30 PM Session 18: Case Studies II 3:30 PM-4:45 PM Session 17: Device Level Sample Prep 3:30 PM-5:35 PM	Fault Localization Tutorial 8:00 AM-9:00 AM Lab Management Tutorial 8:00 AM-9:00 AM FIB Tutorials 8:00 AM-10:00 AM Electrical and Yield Tutorial 9:00 AM-10:00 AM Fault Localization Tutorial 9:00 AM-10:00 AM Session 19: Counterfeit Electronics Detection and Mitigation 10:15 AM-11:30 AM Session 20: Circuit Edit: Beam Interaction Studies 10:15 AM-11:55 AM	Session 22: Circuit Edit: Processing Strategies 12:55 PM-2:10 PM Session 21: Chip Level Sample Prep 12:55 PM-3:10 PM Focused Ion Beam (FIB) User Group 2:10 PM-3:45 PM Sample Preparation User Group 3:25 PM-5:00 PM Session 23: Test and Diagnosis 3:25 PM-5:05 PM
Tutorial	Package and Physical Analysis Challenges I 8:00 AM-11:00 AM Electrical and Yield 9:00 AM-12:00 PM Microscopy I 10:00 AM-3:00 PM	Fault Localization 12:00 PM-6:00 PM Technology Specific FA 1:00 PM-7:00 PM Package and Physical Analysis Challenges II 3:00 PM-5:00 PM
Video Contest						Accepted Movie Submissions 6:30 PM-7:30 PM