39th International Symposium for Testing and Failure Analysis (November 3 – 7, 2013)

November 03 - 07, 2013

Dr. Bernadette Domengès

LAMIPS, CRISMAT – NXP semiconductors - Presto-Engineering Europe laboratory, CNRS-UMR6508; ENSICAEN, UCBN
Presto-Engineering Europe
2, rue de la girafe,
CAEN France 14000

Papers:
7.7 Evaluation of Digital Holography Microscopy for Roughness Control Prior Wafer Direct Bonding