39th International Symposium for Testing and Failure Analysis (November 3 – 7, 2013)

November 03 - 07, 2013

Mr. Sinjin Dixon-Warren

Chipworks
1891 Robertson Road
Suite 500
Ottawa, ON
Canada K2H 5B7

Papers:
11.8 Physical and Electrical Performance Comparison of Identical 28nm Qualcomm Telecommunication Die Produced By Samsung and Tsmc