11.8
Physical and Electrical Performance Comparison of Identical 28nm Qualcomm Telecommunication Die Produced By Samsung and Tsmc

Thursday, November 7, 2013: 1:30 PM
Meeting Room 230A (San Jose McEnery Convention Center)
Mr. Sean Zumwalt , MultiProbe, Santa Barbara, CA
Mr. Anton Riley , Multiprobe Inc, Santa Barbara, CA
Mr. Sinjin Dixon-Warren , Chipworks, Ottawa, ON, Canada

See more of: Session 11: Nanoprobing and Nanoscale Electrical Failure Analysis
See more of: Symposium