39th International Symposium for Testing and Failure Analysis (November 3 – 7, 2013)

November 03 - 07, 2013

Mr. Seung Joon Cha

Principal Engineer
Samsung Electronics co. Ltd
Product & Test Engineering Team
San 24 Nong-su Dong Ki-hung Ku
Young-in South Korea 438-702

Papers:
10.12 Simple and Effective Technique of Backside De-Processing of Thin Flip Chip Package