10.12
Simple and Effective Technique of Backside De-Processing of Thin Flip Chip Package
Simple and Effective Technique of Backside De-Processing of Thin Flip Chip Package
Monday, November 4, 2013
The Tech Museum
Summary:
This paper introduces a simple and effective technique of backside de-processing procedure. The experiment results introduce effective way of sample preparation for backside analysis. The backside silicon image is presented and compared after de-processing with TMAH and KOH which commonly have been using for bulk silicon etchant. Successfully set up the backside de-processing procedure using TMAH as a chemical etchant. This technique is very simple but very effective in case of thin flip chip package. No damage or residue was remained and obtained high uniformity profile all around the sample. After removing side wall of package molding, it was possible to inspect around chip edge area with high quality SEM image. It took away the barrier of reflection of secondary electrons. With this simple backside de-processing procedure, it is possible to prepare a sample for further backside analysis introduced from many other papers such as FIB cross section, oxide damage inspection and EBAC analysis.
This paper introduces a simple and effective technique of backside de-processing procedure. The experiment results introduce effective way of sample preparation for backside analysis. The backside silicon image is presented and compared after de-processing with TMAH and KOH which commonly have been using for bulk silicon etchant. Successfully set up the backside de-processing procedure using TMAH as a chemical etchant. This technique is very simple but very effective in case of thin flip chip package. No damage or residue was remained and obtained high uniformity profile all around the sample. After removing side wall of package molding, it was possible to inspect around chip edge area with high quality SEM image. It took away the barrier of reflection of secondary electrons. With this simple backside de-processing procedure, it is possible to prepare a sample for further backside analysis introduced from many other papers such as FIB cross section, oxide damage inspection and EBAC analysis.