39th International Symposium for Testing and Failure Analysis (November 3 – 7, 2013)

November 03 - 07, 2013

Chua Kok Keng

Engineer
Xilinx Asia Pacific Pte Ltd
QNG
5 Changi Business Park Vista, Singapore 486040
Singapore Singapore 486040

Papers:
10.6 Die Level Defect Analysis Using Combined Techniques of AFP with Electron Microscopes