Featured Talk - Oil & Gas

Sunday, November 6, 2016: 4:00 PM-5:00 PM
110A (Fort Worth Convention Center)
The hostile environment to which microelectronics are subjected in Logging While Drilling (LWD) operations presents a challenging set of failure modes. High temperature combined with high vibration facilitates a different set of reliability concerns not encountered for typical microelectronics applications. An overview of common failure modes will be given, highlighting vibration induced cracks and latent failures due to Kirkendall voiding of wirebonds. The latter shall be discussed at length before a brief selection of case studies are presented, demonstrating analysis techniques of several types (optical, acoustic, X-ray, decapsulation, cross-section, ion-mill polish, SEM, EDS).
Session Chairs:  Mr. Mark Jenkins, Microsystems Failure Analysis, Sandia National Laboratories, Albuquerque, NM and Mr. Corey Senowitz, Qualcomm Technologies Inc., San Diego, CA
4:00 PM
Oil & Gas Microelectronics Failure Analysis: Methodologies and Selected Case Studies
Mr. John Bescup, Weatherford Drilling Services; Chris Yarbrough, Weatherford Drilling Services; Fardin Farzaneh, Weatherford Drilling Services; Mr. Kultaransingh (Bobby) Hooghan, Weatherford Laboratories; Mike Dixon, Weatherford Laboratories
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