42nd International Symposium for Testing and Failure Analysis (November 6-10, 2016): At-A-Glance
42nd International Symposium for Testing and Failure Analysis (November 6-10, 2016): At-A-Glance
SUNDAY November 6
Tutorial
AM
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Package and Physical Analysis Challenges I8:00 AM-11:30 AM
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Electrical and Yield8:00 AM-2:00 PM
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Fault Isolation8:00 AM-5:30 PM
PM
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Microscopy1:00 PM-6:00 PM
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Featured Talk - Device Medical2:00 PM-3:30 PM
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Featured Talk - Oil & Gas4:00 PM-5:00 PM
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Emerging Technology Specific FA5:00 PM-6:00 PM
MONDAY November 7
Technical Program
AM
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Introduction - Opening Session8:00 AM-9:15 AM
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Morning Refreshment Break9:15 AM-9:35 AM
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Emerging FA Techniques and Concepts9:35 AM-11:40 AM
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Lunch11:40 AM-12:35 PM
PM
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Nanoprobing and Electrical Characterization I12:35 PM-1:50 PM
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Device FA12:35 PM-2:15 PM
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Sample Preparation and Device Deprocessing12:35 PM-2:15 PM
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Afternoon Refreshment Break2:15 PM-2:25 PM
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Case Studies and FA Process I2:25 PM-3:40 PM
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Nanoprobing and Electrical Characterization II2:25 PM-3:40 PM
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Reverse Engineering I2:25 PM-3:40 PM
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NanoProbing User Group3:40 PM-5:40 PM
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Sample Prep / 3D Package Prep User Group3:40 PM-5:40 PM
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Tools of the Trade Tour5:00 PM-6:45 PM
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Social Event - Billy Bob's Texas7:00 PM-10:00 PM
TUESDAY November 8
Technical Program
AM
-
Plenary Session9:15 AM-10:30 AM
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Morning Refreshment Break10:30 AM-10:45 AM
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Board and System Level FA I10:45 AM-12:00 PM
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Case Studies and FA Process II10:45 AM-12:00 PM
PM
-
Lunch on Show Floor12:00 PM-1:30 PM
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Board and System Level FA II1:30 PM-2:20 PM
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Afternoon Refreshment Break2:20 PM-2:55 PM
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FIB Circuit Analysis and Edit2:55 PM-5:00 PM
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Reverse Engineering II2:55 PM-5:00 PM
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Expo Networking Reception5:00 PM-6:40 PM
Tutorial
PM
-
Package and Physical Analysis Challenges II1:30 PM-2:20 PM
WEDNESDAY November 9
Technical Program
AM
-
3D Devices Failure Analysis8:00 AM-9:40 AM
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Scanning Probe Analysis I8:00 AM-9:40 AM
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Morning Refreshment Break9:40 AM-10:10 AM
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Panel Discussion: Next generation of FA engineer10:10 AM-12:15 PM
PM
-
EDFAS Luncheon and General Membership Meeting12:15 PM-1:30 PM
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Lunch12:15 PM-1:30 PM
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3D Devices Failure Analysis - Poster1:30 PM-3:30 PM
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Board and System Level FA - Poster1:30 PM-3:30 PM
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Case Studies and FA Process - Poster1:30 PM-3:30 PM
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Detecting and Preventing Counterfeit Microelectronics - Poster1:30 PM-3:30 PM
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Device FA - Poster1:30 PM-3:30 PM
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Emerging FA Techniques and Concepts - Poster1:30 PM-3:30 PM
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FIB Circuit Analysis and Edit - Poster1:30 PM-3:30 PM
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FIB Sample Preparation - Poster1:30 PM-3:30 PM
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Fault Isolation - Poster1:30 PM-3:30 PM
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Local Student Poster Session1:30 PM-3:30 PM
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Microscopy - Poster1:30 PM-3:30 PM
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Nanoprobing and Electrical Characterization - Poster1:30 PM-3:30 PM
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Packaging and Assembly Level FA - Poster1:30 PM-3:30 PM
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Poster Session / Video Contest / Dessert Reception1:30 PM-3:30 PM
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Reverse Engineering - Poster1:30 PM-3:30 PM
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Sample Preparation and Device Deprocessing - Poster1:30 PM-3:30 PM
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Scanning Probe Analysis - Poster1:30 PM-3:30 PM
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Case Studies and FA Process III3:30 PM-6:00 PM
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Microscopy3:30 PM-6:00 PM
THURSDAY November 10
Technical Program
AM
-
FIB Sample Preparation8:00 AM-9:40 AM
-
Fault Isolation I8:00 AM-9:40 AM
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Morning Refreshment Break9:40 AM-9:50 AM
-
Detecting and Preventing Counterfeit Microelectronics9:50 AM-11:55 AM
-
Packaging and Assembly Level FA9:50 AM-11:55 AM
-
Lunch11:55 AM-12:55 PM
PM
-
Fault Isolation II12:55 PM-2:20 PM
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Scanning Probe Analysis II12:55 PM-2:20 PM
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Afternoon Refreshment Break2:20 PM-2:30 PM
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Contactless Fault Isolation User Group2:30 PM-4:30 PM
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FIB User Group2:30 PM-4:30 PM