New Insight into Interconnect Defect Analysis for DRAM
New Insight into Interconnect Defect Analysis for DRAM
Wednesday, November 8, 2017
Summary:
This paper present electrical test method that divide weak or strong interconnect defects of DRAM PKG pads. Proposed method is verified with statistical analysis of 800K DRAM chips and physical analysis of failure chips.
This paper present electrical test method that divide weak or strong interconnect defects of DRAM PKG pads. Proposed method is verified with statistical analysis of 800K DRAM chips and physical analysis of failure chips.