43rd International Symposium for Testing and Failure Analysis (November 5-9, 2017): At-A-Glance
43rd International Symposium for Testing and Failure Analysis (November 5-9, 2017): At-A-Glance
SUNDAY November 5
Tutorial
AM
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Package and Physical Analysis Challenges I8:00 AM-10:00 AM
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Electrical and Yield I8:00 AM-12:20 PM
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Microscopy8:00 AM-2:30 PM
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Morning Refreshment Break10:00 AM-10:20 AM
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Fault Isolation I10:20 AM-2:30 PM
PM
-
Lunch12:20 PM-1:00 PM
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Featured Tutorial Talks I1:00 PM-2:30 PM
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Afternoon Refreshment Break2:30 PM-2:50 PM
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Electrical and Yield II2:50 PM-5:20 PM
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Fault Isolation II2:50 PM-5:20 PM
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Package and Physical Analysis Challenges II2:50 PM-5:20 PM
MONDAY November 6
Technical Program
AM
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Opening Session8:00 AM-9:20 AM
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Morning Refreshment Break9:10 AM-9:40 AM
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Emerging FA Techniques and Concepts9:40 AM-11:20 AM
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Lunch11:20 AM-12:20 PM
PM
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Mixed Mode & High Power Devices Case Studies12:20 PM-2:25 PM
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Packaging and Assembly Level FA12:20 PM-2:25 PM
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Afternoon Refreshment Break2:50 PM-3:00 PM
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3D Devices Failure Analysis3:00 PM-4:40 PM
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Nanoprobing and Electrical Characterization I3:00 PM-5:05 PM
TUESDAY November 7
Technical Program
AM
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Keynote Session: Adam Steltzner9:15 AM-10:30 AM
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Morning Refreshment Break10:30 AM-11:10 AM
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Board and System Level FA11:10 AM-12:00 PM
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Detecting and Preventing Counterfeit Microelectronics11:10 AM-12:00 PM
PM
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Lunch on Expo Floor12:00 PM-1:20 PM
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Hardware attacks, security, and reverse engineering1:20 PM-3:00 PM
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Scanning Probe Analysis1:20 PM-3:00 PM
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Afternoon Refreshment Break3:00 PM-3:40 PM
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Nanoprobing and Electrical Characterization II3:40 PM-4:55 PM
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Product Yield, Test & Diagnostics3:40 PM-4:55 PM
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Expo Networking Reception5:00 PM-6:30 PM
Tutorial
AM
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Featured Tutorial Talks II8:00 AM-9:00 AM
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Featured Tutorial Talks III8:00 AM-9:00 AM
WEDNESDAY November 8
Technical Program
AM
-
Fault Isolation I8:00 AM-9:40 AM
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Microscopy I8:00 AM-9:40 AM
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Morning Refreshment Break9:40 AM-10:10 AM
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Panel Discussion: Striving for 100% Success Rate10:10 AM-12:00 PM
PM
-
EDFAS Luncheon and General Membership Meeting12:00 PM-1:30 PM
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3D Devices Failure Analysis - Poster1:30 PM-3:30 PM
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Board and System Level FA - Poster1:30 PM-3:30 PM
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Detecting and Preventing Counterfeit Microelectronics - Poster1:30 PM-3:30 PM
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Emerging FA Techniques and Concepts - Poster1:30 PM-3:30 PM
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FA Processes Case Studies - Poster1:30 PM-3:30 PM
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FIB Circuit Analysis and Edit - Poster1:30 PM-3:30 PM
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FIB Sample Preparation - Poster1:30 PM-3:30 PM
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Fault Isolation - Poster1:30 PM-3:30 PM
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Hardware attacks, security, and reverse engineering - Poster1:30 PM-3:30 PM
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Low Power Devices Case Studies - Poster1:30 PM-3:30 PM
-
Microscopy - Poster1:30 PM-3:30 PM
-
Mixed Mode & High Power Devices Case Studies - Poster1:30 PM-3:30 PM
-
Nanoprobing and Electrical Characterization - Poster1:30 PM-3:30 PM
-
Packaging and Assembly Level FA - Poster1:30 PM-3:30 PM
-
Product Yield, Test & Diagnostics - Poster1:30 PM-3:30 PM
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Sample Preparation and Device Deprocessing - Poster1:30 PM-3:30 PM
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Scanning Probe Analysis - Poster1:30 PM-3:30 PM
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Space Application FA - Poster1:30 PM-3:30 PM
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Microscopy II3:30 PM-5:10 PM
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Space Application FA3:30 PM-5:35 PM
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3D-IC / Package / Sample Prep User Group5:40 PM-7:40 PM
THURSDAY November 9
Technical Program
AM
-
FIB Sample Preparation8:00 AM-9:40 AM
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Fault Isolation II8:00 AM-9:40 AM
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Morning Refreshment Break9:40 AM-9:50 AM
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FA Processes Case Studies I9:50 AM-12:20 PM
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Sample Preparation and Device Deprocessing9:50 AM-12:20 PM
PM
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Contactless Optical/Nano-Probing EFA User Group12:20 PM-2:20 PM
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FIB User Group12:20 PM-2:20 PM
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Lunch12:20 PM-2:20 PM
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FIB Circuit Analysis and Edit2:20 PM-3:35 PM
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Low Power Devices Case Studies / FA Processes Case Studies II2:20 PM-4:00 PM