43rd International Symposium for Testing and Failure Analysis (November 5-9, 2017)

Sunday, November 5, 2017

8:00 AM-10:00 AM

Package and Physical Analysis Challenges I
Session Chair: Mr. Chris Richardson and Mr. John Bescup

8:00 AM-12:20 PM

Electrical and Yield I
Session Chair: Mr. Gregory M. Johnson and Mr. Randal E. Mulder

8:00 AM-2:30 PM

Microscopy
Session Chair: Ms. Susan Li and Ms. Rose Ring

10:00 AM-10:20 AM

Morning Refreshment Break

10:20 AM-2:30 PM

Fault Isolation I
Session Chair: Dr. Mayue Xie and Mr. Frank Altmann

12:20 PM-1:00 PM

Lunch

1:00 PM-2:30 PM

Featured Tutorial Talks I
Session Chair: Mr. Mark Jenkins and Mr. Corey Senowitz

2:30 PM-2:50 PM

Afternoon Refreshment Break

2:50 PM-5:20 PM

Electrical and Yield II
Session Chair: Mr. Gregory M. Johnson and Mr. Randal E. Mulder

Fault Isolation II
Session Chair: Dr. Mayue Xie and Mr. Frank Altmann

Package and Physical Analysis Challenges II
Session Chair: Mr. Chris Richardson and Mr. John Bescup

Monday, November 6, 2017

8:00 AM-9:20 AM

Opening Session

9:10 AM-9:40 AM

Morning Refreshment Break

9:40 AM-11:20 AM

Emerging FA Techniques and Concepts
Session Chair: Mr. Dan Bodoh and Prof. Christian Boit

11:20 AM-12:20 PM

Lunch

12:20 PM-2:25 PM

Mixed Mode & High Power Devices Case Studies
Session Chair: Dr. Michael Bruce and Mr. Stephen T. Fasolino

Packaging and Assembly Level FA
Session Chair: Dr. Peng Li and Dr. Wentao Qin

2:50 PM-3:00 PM

Afternoon Refreshment Break

3:00 PM-4:40 PM

3D Devices Failure Analysis
Session Chair: Ms. Claudia Keller and Dr. Christian Schmidt

3:00 PM-5:05 PM

Nanoprobing and Electrical Characterization I
Session Chair: Mr. John Sanders and Ms. Sweta Pendyala

Tuesday, November 7, 2017

8:00 AM-9:00 AM

Featured Tutorial Talks II
Session Chair: Mr. Mark Jenkins and Mr. Corey Senowitz

Featured Tutorial Talks III
Session Chair: Mr. Chris Richardson and Mr. John Bescup

9:15 AM-10:30 AM

Keynote Session: Adam Steltzner

10:30 AM-11:10 AM

Morning Refreshment Break

11:10 AM-12:00 PM

Board and System Level FA
Session Chair: Mr. Bhanu P. Sood and Mr. Jason Wheeler

Detecting and Preventing Counterfeit Microelectronics
Session Chair: Mr. Michael D. Woo and Mr. Luigi L. Aranda

12:00 PM-1:20 PM

Lunch on Expo Floor

1:20 PM-3:00 PM

Hardware attacks, security, and reverse engineering
Session Chair: Dr. Navid Asadi and Dr. Sahar Hihath

Scanning Probe Analysis
Session Chair: Mr. Phil Kaszuba and Mr. Jocho Nxumalo

3:00 PM-3:40 PM

Afternoon Refreshment Break

3:40 PM-4:55 PM

Nanoprobing and Electrical Characterization II
Session Chair: Mr. John Sanders and Ms. Sweta Pendyala

Product Yield, Test & Diagnostics
Session Chair: Dr. Rao Desineni, Dr. Manish Sharma and Mr. Sounil Biswas

5:00 PM-6:30 PM

Expo Networking Reception

Wednesday, November 8, 2017

8:00 AM-9:40 AM

Fault Isolation I
Session Chair: Mr. Kent Erington and Dr. Keith A. Serrels

Microscopy I
Session Chair: Dr. Yu Zhu and Dr. Tom Schamp

1:30 PM-3:30 PM

3D Devices Failure Analysis - Poster
Session Chair: Ms. Claudia Keller and Dr. Christian Schmidt

Board and System Level FA - Poster
Session Chair: Mr. Bhanu P. Sood and Mr. Jason Wheeler

Detecting and Preventing Counterfeit Microelectronics - Poster
Session Chair: Mr. Michael D. Woo and Mr. Luigi L. Aranda

Emerging FA Techniques and Concepts - Poster
Session Chair: Mr. Dan Bodoh and Prof. Christian Boit

FA Processes Case Studies - Poster
Session Chair: Dr. James J. Demarest and Dr. Andreas Meyer

FIB Circuit Analysis and Edit - Poster
Session Chair: Dr. Ken Lagarec and Dr. Ted R. Lundquist

FIB Sample Preparation - Poster
Session Chair: Dr. Bryan Tracy, PhD and Dr. Haifeng Wang, PhD

Fault Isolation - Poster
Session Chair: Mr. Kent Erington and Dr. Keith A. Serrels

Hardware attacks, security, and reverse engineering - Poster
Session Chair: Dr. Navid Asadi and Dr. Sahar Hihath

Low Power Devices Case Studies - Poster
Session Chair: Dr. Szu Huat Goh and Mr. Gil Garteiz

Microscopy - Poster
Session Chair: Dr. Yu Zhu and Dr. Tom Schamp

Mixed Mode & High Power Devices Case Studies - Poster
Session Chair: Dr. Michael Bruce and Mr. Stephen T. Fasolino

Nanoprobing and Electrical Characterization - Poster
Session Chair: Mr. John Sanders and Ms. Sweta Pendyala

Packaging and Assembly Level FA - Poster
Session Chair: Dr. Peng Li and Dr. Wentao Qin

Product Yield, Test & Diagnostics - Poster
Session Chair: Dr. Manish Sharma and Mr. Sounil Biswas

Sample Preparation and Device Deprocessing - Poster
Session Chair: Dr. Erwin Hendarto and Dr. Yuanjing Li

Scanning Probe Analysis - Poster
Session Chair: Mr. Phil Kaszuba and Mr. Jocho Nxumalo

Space Application FA - Poster
Session Chair: Mr. Ted Kolasa and Dr. Richard Blank

3:30 PM-5:10 PM

Microscopy II
Session Chair: Dr. Yu Zhu and Dr. Tom Schamp

3:30 PM-5:35 PM

Space Application FA
Session Chair: Mr. Ted Kolasa and Dr. Richard Blank

5:40 PM-7:40 PM

3D-IC / Package / Sample Prep User Group
Session Chair: Dr. Nathan Bakken, PhD, Mr. Timothy Hazeldine and Ashraf Rezaie

Thursday, November 9, 2017

8:00 AM-9:40 AM

FIB Sample Preparation
Session Chair: Dr. Bryan Tracy, PhD and Dr. Haifeng Wang, PhD

Fault Isolation II
Session Chair: Mr. Kent Erington and Dr. Keith A. Serrels

9:40 AM-9:50 AM

Morning Refreshment Break

9:50 AM-12:20 PM

FA Processes Case Studies I
Session Chair: Dr. James J. Demarest and Dr. Andreas Meyer

Sample Preparation and Device Deprocessing
Session Chair: Dr. Erwin Hendarto and Dr. Yuanjing (Jane) Li

12:20 PM-2:20 PM

Contactless Optical/Nano-Probing EFA User Group
Session Chair: Mr. Dan Bockelman, Ms. Sweta Pendyala and Nebojsa Jankovic

FIB User Group
Session Chair: Mr. Steven B. Herschbein, Mr. Michael Wong and Mr. Dane Scott

Lunch

2:20 PM-3:35 PM

FIB Circuit Analysis and Edit
Session Chair: Dr. Ken Lagarec and Dr. Ted R. Lundquist

2:20 PM-4:00 PM

Low Power Devices Case Studies / FA Processes Case Studies II
Session Chair: Dr. Szu Huat Goh and Mr. Gil Garteiz