Failure Analysis of a Silicon Die Integrated in a Vacuum Assembly

Wednesday, November 8, 2017: 5:10 PM
Ballroom A (Pasadena Convention Center)
Mr. Gil Garteiz , California Institute of Technology, Pasadena, CA
Mr. Javeck Verdugo , California Institute of Technology, Pasadena, CA
Mr. David Aveline , California Institute of Technology, Pasadena, CA
Mr. Eric Williams , California Institute of Technology, Pasadena, CA
Mr. Arvid Croonquist , California Institute of Technology, Pasadena, CA
Dr. Richard Blank , California Institute of Technology, Pasadena, CA

Summary:

This paper will show a case study of a unique FA on a silicon die that was at the heart of a failure in a vacuum assembly. Challenges to visualize the failure mechanism without proceeding destructively will be discussed, as well as the finding.
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