Package and Physical Analysis Challenges II

Sunday, October 28, 2018: 2:50 PM-5:20 PM

226BC (Phoenix Convention Center)

Mr. Chris Richardson, Allied High Tech Products, Inc. and Mr. John Bescup, Weatherford Drilling Services

2:50 PM

SAM vs X-RAY
Dr. Thomas M. Moore, Waviks, Inc.

3:50 PM

Package Level Fault Isolation
Dr. Lihong Cao, Advanced Micro Devices

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