44th International Symposium for Testing and Failure Analysis (Oct. 28 - Nov. 1, 2018): At-A-Glance
44th International Symposium for Testing and Failure Analysis (Oct. 28 - Nov. 1, 2018): At-A-Glance
SUNDAY October 28
Tutorial
AM
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Package and Physical Analysis Challenges I8:00 AM-10:00 AM
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Electrical and Yield I8:00 AM-11:20 AM
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Microscopy I8:00 AM-11:50 AM
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Fault Isolation10:20 AM-5:20 PM
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Featured Tutorials I11:20 AM-2:30 PM
PM
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Microscopy II1:00 PM-2:30 PM
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Electrical and Yield II2:50 PM-4:20 PM
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Package and Physical Analysis Challenges II2:50 PM-5:20 PM
MONDAY October 29
Technical Program
AM
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Continental Breakfast7:30 AM-9:00 AM
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Opening Session and EDFAS General Membership Meeting8:00 AM-10:00 AM
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Morning Refreshment Break10:00 AM-10:20 AM
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Emerging FA Techniques and Concepts10:20 AM-12:20 PM
PM
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Lunch12:00 PM-1:00 PM
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Fault Isolation1:00 PM-2:40 PM
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Scanning Probe Analysis I1:00 PM-3:05 PM
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Afternoon Refreshment Break3:05 PM-3:25 PM
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Scanning Probe Analysis II3:25 PM-4:15 PM
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Board and System Level FA3:25 PM-4:40 PM
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Tools of the Trade Tour5:00 PM-6:45 PM
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Social Event: Lucky Strike7:00 PM-10:00 PM
TUESDAY October 30
Technical Program
AM
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Panel Session: Is it worth analyzing?8:00 AM-9:30 AM
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Morning Refreshment Break9:30 AM-10:10 AM
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Detecting and Preventing Counterfeit Microelectronics10:10 AM-11:50 AM
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Product Yield, Test & Diagnostics10:35 AM-11:50 AM
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Lunch on the Expo Floor11:30 AM-1:00 PM
PM
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3D Device Failure Analysis1:00 PM-3:05 PM
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Hardware Attacks, Security, and Reverse Engineering I1:00 PM-3:05 PM
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Afternoon Refreshment Break3:05 PM-3:40 PM
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FA Processes Case Studies I3:40 PM-5:20 PM
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Expo Networking Reception5:30 PM-7:15 PM
Tutorial
AM
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Featured Tutorials II10:10 AM-11:40 AM
PM
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Microscopy III3:40 PM-5:10 PM
WEDNESDAY October 31
Technical Program
AM
-
FA Processes Case Studies II8:00 AM-9:40 AM
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Sample Preparation and Device Deprocessing I8:00 AM-9:40 AM
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Morning Refreshment Break9:40 AM-10:10 AM
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Keynote Session10:10 AM-11:40 AM
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Lunch on the Expo Floor11:30 AM-1:00 PM
PM
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Mixed Mode & High Power Devices Case Studies1:05 PM-1:30 PM
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Sample Preparation and Device Deprocessing II1:05 PM-2:20 PM
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Nanoprobing and Electrical Characterization I1:30 PM-2:20 PM
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3D Device FA - POSTER2:20 PM-4:20 PM
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Board and System Level FA - POSTER2:20 PM-4:20 PM
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FA Processes Case Studies - POSTER2:20 PM-4:20 PM
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FIB Circuit Analysis and Edit - POSTER2:20 PM-4:20 PM
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FIB Sample Preparation - POSTER2:20 PM-4:20 PM
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Fault Isolation - POSTER2:20 PM-4:20 PM
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Low Power Devices and Test Structures Case Studies - POSTER2:20 PM-4:20 PM
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Mixed Mode & High Power Devices Case Studies - POSTER2:20 PM-4:20 PM
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Packaging & Assembly Level FA - POSTER2:20 PM-4:20 PM
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Poster Session2:20 PM-4:20 PM
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Product Yield, Test & Diagnostics - POSTER2:20 PM-4:20 PM
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Sample Prep and Device Processing - POSTER2:20 PM-4:20 PM
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Scanning Probe Analysis - POSTER2:20 PM-4:20 PM
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Nanoprobing and Electrical Characterization II4:20 PM-5:10 PM
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Space Application FA4:20 PM-5:10 PM
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User Group: Sample Preparation5:20 PM-7:20 PM
Video Contest
PM
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Video Contest2:20 PM-4:20 PM
THURSDAY November 1
Technical Program
AM
-
FIB Sample Preparation8:00 AM-9:40 AM
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Microscopy I8:00 AM-9:40 AM
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Morning Refreshment Break9:40 AM-9:50 AM
-
Microscopy II9:50 AM-11:30 AM
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Packaging & Assembly Level FA9:50 AM-11:30 AM
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Lunch11:30 AM-1:30 PM
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User Group: Contactless Optical / Nano-Probing EFA User Group11:30 AM-1:30 PM
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User Group: FIB11:30 AM-1:30 PM
PM
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FIB Circuit Analysis and Edit1:30 PM-2:45 PM
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Low Power Devices and Test Structures Case Studies1:30 PM-2:45 PM