Prof. Ingrid De Wolf

Scientific director
imec
Leuven Belgium 3001

Papers:

Localization of dielectric breakdown sites in 3D through-silicon via (TSV) interconnects by laser stimulation and chip deprocessing
GHz-Scanning Acoustic Microscopy combined with ToF-SIMS/AFM for wafer-level failure analysis of bonding interfaces.
NEW! - Failure Analysis Techniques for 3D-stacked ICs