45th International Symposium for Testing and Failure Analysis (Nov. 10-14, 2019):

45th International Symposium for Testing and Failure Analysis (Nov. 10-14, 2019)
November 10 - 14, 2019

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Mr. Paul Fischione

CEO
E.A. Fischione Instruments, Inc.
Export, PA
USA 15632

Papers:

High throughput and multiple length scale sample preparation for characterization and failure analysis of advanced semiconductor devices
Solder bump joint failure investigation: From sample preparation to advanced structural characterization and strain measurement
Ultra-thinning of silicon for backside fault isolation

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General Information

November 10 - 14, 2019


Portland, OR