Package and Physical Analysis Challenges II

Sunday, November 10, 2019: 2:20 PM-4:20 PM
F 151 (Oregon Convention Center)
Mr. Chris Richardson, Allied High Tech Products, Inc. and Mr. John Bescup, NASA JPL
2:20 PM
SAM vs X-Ray
Dr. Thomas M. Moore, Waviks, Inc.
3:20 PM
NEW! - Advanced FIB Sample Preparation and Analysis
Dr. Sam Subramanian, NXP Semiconductors
See more of: Tutorial
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