Innovative Base Die Debug Technique with TSV Wirebond for 3D Stack-Die Devices

Monday, December 7, 2020: 1:55 PM
Dr. Wen-Hsien Chuang , Intel, Hillsboro, OR
Dr. Tom X. Tong , Intel, Hillsboro, OR
Mrs. May Ling Oh , Intel, Hillsboro, OR
Dr. Hyuk Ju Ryu , Intel, Hillsboro, OR
Dr. Di Xu , Intel, Hillsboro, OR
Mr. Swaran Kumar , Intel, Hillsboro, OR
Mr. Shuai Zhao , Intel, Hillsboro, OR
Mrs. Jennifer Huening , Intel, Hillsboro, OR
Dr. Chia-Yi Chen , Intel, Hillsboro, OR
Mr. Charles W Ladwig , Intel, Hillsboro, OR
Mr. Joshua D Foster , Intel, Hillsboro, OR
Mrs. Lacey Badger , Intel, Hillsboro, OR

See more of: 3D Device Failure Analysis
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