3D Device Failure Analysis
Monday, December 7, 2020: 1:30 PM-3:10 PM
Dr. Shidong Li, IBM and Ms. Claudia Keller, Infineon Technologies Munich
1:55 PM
Innovative Base Die Debug Technique with TSV Wirebond for 3D Stack-Die Devices
Dr. Wen-Hsien Chuang, Intel;
Dr. Tom X. Tong, Intel;
Mrs. May Ling Oh, Intel;
Dr. Hyuk Ju Ryu, Intel;
Dr. Di Xu, Intel;
Mr. Swaran Kumar, Intel;
Mr. Shuai Zhao, Intel;
Mrs. Jennifer Huening, Intel;
Dr. Chia-Yi Chen, Intel;
Mr. Charles W Ladwig, Intel;
Mr. Joshua D Foster, Intel;
Mrs. Lacey Badger, Intel
2:45 PM
Addressing Failures in Advanced Packaging through a Correlative Workflow
Mr. Neel Leslie, Thermo Fisher Scientific;
Mr. Heebeom Lee, Thermo Fisher Scientific;
Ms. Zuzana Patakova, Thermofisher;
Mr. Brian Lai, Thermo Fisher Scientific;
Mingi Lee, Thermo Fisher Scientific;
Dr. Christopher H. Kang, Thermo Fisher Scientific;
Mr. Frantisek Zelenka, Thermofisher;
Dr. Trond Varslot, Thermofisher
