Localization and Characterization of Defects for Advanced Packaging Using Novel EOTPR Probing Approach and Simulation

Tuesday, December 8, 2020: 3:25 PM
Dr. Chuan Zhang , NVIDIA Corporation, Santa Clara, CA
Dr. Jane Y. Li , NVIDIA Corporation, Santa Clara, CA
Mr. John Aguada , NVIDIA Corporation, Santa Clara, CA
Mr. Jonathon Elliott , NVIDIA Corporation, Santa Clara, CA
Dr. Somayyeh Rahimi , NVIDIA Corporation, Santa Clara, CA
Dr. Christian Schmidt , NVIDIA Corporation, Santa Clara, CA
Mr. Howard Marks , NVIDIA Corporation, Santa Clara, CA
Dr. Thomas White , TeraView Limited, Cambridge, United Kingdom
Dr. Jesse Alton , TeraView Limited, Cambridge, United Kingdom
Mr. Brett Gibson , TeraView Limited, Cambridge, United Kingdom
Mr. Martin Igarashi , TeraView Limited, Cambridge, United Kingdom

Summary:

In this paper, we show how the EOTPR approach can be extended to provide solutions for the growing complexity of advanced packages. Firstly, we demonstrated how localization of defects can be performed in traces without an external connection, through the use of an innovative cross-sectional probing with EOTPR. Secondly, this paper showed that EOTPR simulation can be used to extract the interface resistance, granting an alternative way of quantitative defect characterization using EOTPR without destructive physical analysis. These novel approaches showed the great potential of EOTPR in failure analysis and reliability analysis of advanced packaging.