Packaging and Assembly Level FA
Tuesday, December 8, 2020: 3:25 PM-4:40 PM
Dr. Peng Li, Intel Corporation and Ms. Kannu Wadhwa, ZEISS
3:25 PM
Localization and Characterization of Defects for Advanced Packaging Using Novel EOTPR Probing Approach and Simulation
Dr. Chuan Zhang, NVIDIA Corporation;
Dr. Jane Y. Li, NVIDIA Corporation;
Mr. John Aguada, NVIDIA Corporation;
Mr. Jonathon Elliott, NVIDIA Corporation;
Dr. Somayyeh Rahimi, NVIDIA Corporation;
Dr. Christian Schmidt, NVIDIA Corporation;
Mr. Howard Marks, NVIDIA Corporation;
Dr. Thomas White, TeraView Limited;
Dr. Jesse Alton, TeraView Limited;
Mr. Brett Gibson, TeraView Limited;
Mr. Martin Igarashi, TeraView Limited
