Laser ablation for throughput increase in large volume semiconductor failure analysis tasks

Monday, December 7, 2020: 2:20 PM
Mr. Marek Tuček , TESCAN Brno s.r.o., Brno, Czech Republic
Mr. Martin Búran , TESCAN Brno s.r.o., Brno, Czech Republic
Mr. Rostislav Váňa , TESCAN Brno s.r.o., Brno, Czech Republic
Mr. Lukáš Hladík , TESCAN ORSAY HOLDING a.s., Brno, Czech Republic
Mr. Jozef Vincenc Oboňa , TESCAN ORSAY HOLDING a.s., Brno, Czech Republic

Summary:

We present optimizing large volume semiconductor failure analysis by incorporating a standalone laser ablation tool into Xe plasma FIB workflows, resulting in time investment reduction up to 70% per sample, the ability to quickly access buried structures and overall increase in throughput.