Laser ablation for throughput increase in large volume semiconductor failure analysis tasks
Laser ablation for throughput increase in large volume semiconductor failure analysis tasks
Monday, December 7, 2020: 2:20 PM
Summary:
We present optimizing large volume semiconductor failure analysis by incorporating a standalone laser ablation tool into Xe plasma FIB workflows, resulting in time investment reduction up to 70% per sample, the ability to quickly access buried structures and overall increase in throughput.
We present optimizing large volume semiconductor failure analysis by incorporating a standalone laser ablation tool into Xe plasma FIB workflows, resulting in time investment reduction up to 70% per sample, the ability to quickly access buried structures and overall increase in throughput.