Benefits of using a CF4-Free Microwave Induced Plasma (MIP) Spot Etch Process to Remove Underfill and Analyze 2.5D Modules

Tuesday, December 8, 2020: 3:50 PM

Mr. Kevin A. Distelhurst, BS/MS Electrical Engineering , GLOBALFOUNDRIES, Essex Jct., VT

Mr. Daniel A. Bader , GLOBALFOUNDRIES, Essex Jct., VT

Mr. Joe Myers , GLOBALFOUNDRIES, Essex Jct., VT

Mr. Ron Russotti , GLOBALFOUNDRIES, Essex Jct., VT

Mr. Mark McKinnon , JIACO Instruments, Delft, Netherlands

Dr. Jiaqi Tang , JIACO Instruments, Delft, Netherlands

Mr. Pradip Sairam Pichumani , Facebook, Redmond, WA