Panel Discussion: Trends and Challenges in 3D Packaging & MEMS Failure Analysis

Tuesday, December 8, 2020: 11:00 AM-12:20 PM

Dr. Christian Schmidt, Nvidia and Mr. Kristofor Dickson, NXP Semiconductors

11:00 AM

Panelist
Mr. Ryan Ross, GlobalFoundries

11:20 AM

Panelist
Mr. Martin Igarashi, TeraView Limited

11:40 AM

Panelist
Ms. Yan Li, Intel

12:00 PM

Panelist
Ms. Allyson Hartzell, Philips