EDFAS Virtual Workshop

December 07 - 09, 2020

Lunch & Learn Workshop: ZEISS - Advanced Package Analysis Solutions for the More-than-Moore Era

With the slowing of Moore’s Law, there has never been more urgency to address challenges for integrated circuit (IC) package characterization and failure analysis (FA) in the More than Moore (MtM) era. Diverse IC package strategies exist to enable the highest system performance. As a result, package developers and failure analysts are faced with complex 3D package architectures and shrinking package interconnect pitches down to a few microns. Meanwhile, the transition from monolithic IC to heterogenous system-on-chip (SOC) leads to package footprints approaching >100mm x 100mm and I/O areal density is projected to reach one million per millimeter of area. These trends drive requirements for new capabilities across the entire FA workflow. New ZEISS package analysis solutions addressing MtM challenges will be presented for 3D X-ray imaging and a new “packaging FIB”, the Crossbeam laser. These technologies represent significant advancements for package characterization and the FA workflow.