Package and Physical Analysis Challenges II

Sunday, October 31, 2021: 3:50 PM-5:30 PM
105 AB (Phoenix Convention Center)
Dr. Wentao Qin, ON Semiconductor and Mr. John Bescup, Jet Propulsion Laboratory
3:50 PM
(V) Failure analysis for hardware security
Dr. Navid Asadi, University of Florida
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