47th International Symposium for Testing and Failure Analysis (Oct. 31 - Nov. 4, 2021): At-A-Glance
47th International Symposium for Testing and Failure Analysis (Oct. 31 - Nov. 4, 2021): At-A-Glance
SUNDAY October 31
Tutorial
AM
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Electrical and Yield I8:00 AM-10:00 AM
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Package and Physical Analysis Challenges I8:00 AM-11:50 AM
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Fault Isolation I9:00 AM-2:00 PM
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Lunch11:50 AM-12:30 PM
PM
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Featured Talks12:30 PM-3:50 PM
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Microscopy12:30 PM-3:50 PM
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Electrical and Yield II2:20 PM-3:50 PM
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Fault Isolation II3:50 PM-5:20 PM
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Package and Physical Analysis Challenges II3:50 PM-5:30 PM
MONDAY November 1
Technical Program
AM
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Opening Session and EDFAS General Membership Meeting8:00 AM-10:00 AM
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Morning Refreshment Break10:00 AM-10:20 AM
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Emerging FA Techniques and Concepts10:20 AM-12:15 PM
PM
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Lunch12:15 PM-1:30 PM
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Detecting and Preventing Counterfeit Microelectronics1:30 PM-2:20 PM
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Scanning Probe Analysis1:30 PM-2:20 PM
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Afternoon Refreshment Break2:45 PM-3:00 PM
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Die Level Fault Isolation3:00 PM-4:15 PM
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SiP and 3D Devices3:00 PM-4:30 PM
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Case Studies: FA Processes4:15 PM-4:40 PM
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Tools of the Trade Tour5:00 PM-6:45 PM
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Social Event: 810 Billiards & Bowling7:00 PM-10:00 PM
TUESDAY November 2
Technical Program
AM
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Keynote Session: Dr. Ravi Mahajan8:30 AM-9:30 AM
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Morning Refreshment Break9:30 AM-10:10 AM
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AI Applications for FA I10:10 AM-11:50 AM
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Product Yield, Test & Diagnostics I10:10 AM-11:50 AM
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Lunch on the Expo Floor11:50 AM-1:15 PM
PM
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AI Applications for FA II1:15 PM-2:05 PM
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Product Yield, Test & Diagnostics II1:15 PM-2:05 PM
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Afternoon Refreshment Break2:05 PM-2:45 PM
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Sample Prep User Group2:45 PM-5:00 PM
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System on Package User Group2:45 PM-5:00 PM
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Expo Networking Reception5:00 PM-6:30 PM
WEDNESDAY November 3
Technical Program
AM
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Case Studies: Device Analysis8:00 AM-9:40 AM
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Sample Preparation and Device Deprocessing8:00 AM-10:05 AM
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Morning Refreshment Break10:05 AM-10:35 AM
PM
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Lunch on the Expo Floor12:05 PM-1:05 PM
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Poster Session1:05 PM-3:05 PM
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Women in FA2:15 PM-3:00 PM
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Contactless Probing and Nanoprobing User Group3:05 PM-5:20 PM
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FIB User Group3:05 PM-5:20 PM
THURSDAY November 4
Technical Program
AM
-
Hardware Attacks, Security, and Reverse Engineering8:00 AM-9:40 AM
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Packaging and Assembly8:50 AM-9:15 AM
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Board and System Level FA9:15 AM-9:40 AM
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Morning Refreshment Break9:40 AM-9:50 AM
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FIB Circuit Analysis and Edit9:50 AM-10:15 AM
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Nanoprobing, Electrical Characterization9:50 AM-11:55 AM
PM
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Lunch12:20 PM-1:20 PM
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FIB Sample Preparation1:20 PM-3:50 PM
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Microscopy and Material Characterization1:20 PM-3:50 PM
Tutorial
AM
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Packaging and Assembly8:00 AM-8:50 AM
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Microscopy10:15 AM-11:45 AM