Improved Failure Analysis Success Prospects & Efficiency Through Readiness & Smart Solutions For Bench Testing & Fault Localization

Tuesday, November 1, 2022: 3:20 PM
Ballroom B (Pasadena Convention Center)
Mr. Raj Kabadi , On Semiconductor, Phoenix, AZ
Mr. Leandro Muela , ON Semiconductor, Phoenix, AZ

Summary:

Failure Analysts are often required to work on a wide array of part types. These integrated circuits (IC) can have wide ranging functions and applications. Also the ICs can be packaged in a multitude of package types. All these factors compound the challenges for the Failure Analysts This paper provides a brief snapshot of one approach adopted by the ON Semiconductor Product Analysis Labs to prepare in advance for the products that offer significant challenges in terms of electrical bench testing and fault localization. The approach demonstrates how the rate of success of failure analysis can be improved by making available solutions to the Failure Analysts that cut down on the effort required for bench testing and failure verification activities. This in turn can contribute to cycle time reduction and improve overall efficiency of the failure analysis (FA) process.
See more of: Case Studies: FA Processes
See more of: Technical Program