48th International Symposium for Testing and Failure Analysis (Oct. 30 - Nov. 3, 2022): At-A-Glance
48th International Symposium for Testing and Failure Analysis (Oct. 30 - Nov. 3, 2022): At-A-Glance
SUNDAY October 30
Technical Program
AM
-
Sunday's Author's Coffee7:00 AM-8:00 AM
Tutorial
AM
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Electrical and Yield8:00 AM-10:00 AM
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Fault Isolation I & II8:00 AM-1:20 PM
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Microscopy I & II8:00 AM-1:20 PM
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Morning Refreshment Break10:00 AM-10:20 AM
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Package and Physical Analysis Challenges I10:20 AM-1:20 PM
PM
-
Lunch12:20 PM-1:20 PM
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Package and Physical Analysis Challenges II1:30 PM-2:30 PM
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Fault Isolation III1:30 PM-3:50 PM
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Technology Specific and Featured I1:30 PM-3:50 PM
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Afternoon Break3:30 PM-3:50 PM
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Technology Specific and Featured II3:50 PM-4:50 PM
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Technology Specific and Featured III3:50 PM-4:50 PM
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Technology Specific and Featured IV3:50 PM-4:50 PM
MONDAY October 31
Technical Program
AM
-
Monday's Author's Coffee7:00 AM-8:00 AM
-
Opening Session & General Membership Breakfast Meeting7:45 AM-10:00 AM
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Refreshment Break10:00 AM-10:20 AM
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Emerging FA Techniques and Concepts10:20 AM-12:10 PM
PM
-
Lunch12:10 PM-1:10 PM
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Sample Preparation User Group12:10 PM-1:10 PM
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Refreshment Break1:00 PM-1:20 PM
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FIB USER GROUP1:20 PM-2:20 PM
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Hardware Attacks, Security and Reverse Engineering2:20 PM-3:55 PM
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FIB Sample Preparation2:20 PM-5:10 PM
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Board and System Level FA3:55 PM-5:10 PM
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Tools of the Trade5:20 PM-6:30 PM
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Social Event: A Night in Vegas6:30 PM-9:30 PM
Tutorial
PM
-
Package and Physical Analysis Challenges III1:20 PM-2:20 PM
TUESDAY November 1
Technical Program
AM
-
Tuesday's Author's Coffee7:00 AM-8:00 AM
-
Refreshment Break9:30 AM-10:10 AM
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Exhibit Hall Open9:30 AM-6:30 PM
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Standardized and AI Enhanced FA Workflows10:10 AM-12:10 PM
PM
-
Lunch in Exhibit Hall12:10 PM-1:10 PM
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AI Application for FA1:10 PM-4:10 PM
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Case Studies: FA Processes1:10 PM-4:10 PM
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Refreshment Break2:50 PM-3:20 PM
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Product Yield, Test and Diagnostics4:10 PM-5:00 PM
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Sample Preparation and Device Deprocessing4:10 PM-5:00 PM
-
Welcome Reception with Exhibitors5:00 PM-6:30 PM
WEDNESDAY November 2
Technical Program
AM
-
Wednesday's Author's Coffee7:00 AM-8:00 AM
-
FA Roadmap8:00 AM-9:35 AM
-
Refreshment Break9:30 AM-10:00 AM
-
Exhibit Hall Open9:30 AM-4:00 PM
-
Invited Talk: Si Photonics - George Tzintzarov, Aero9:35 AM-10:00 AM
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Packaging and Assembly Level FA9:35 AM-11:40 AM
-
Case Studies: Device Analysis10:00 AM-11:40 AM
-
Lunch in the Exhibit Hall11:40 AM-1:10 PM
-
Special Session: Women in Electronics Failure Analysis (WEFA)11:40 AM-1:10 PM
PM
-
Break1:10 PM-1:20 PM
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Exhibitor Dessert Reception, Poster Session and Video Contest2:50 PM-4:00 PM
THURSDAY November 3
Technical Program
AM
-
Thursday's Author's Coffee7:00 AM-8:00 AM
-
NANO/SCANNING PROBE USER GROUP8:00 AM-9:00 AM
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Invited Talk: Si Photonics - Frieder Baumann, GlobalFoundries8:35 AM-9:00 AM
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SiP and 3D Devices Failure Analysis9:00 AM-10:35 AM
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FIB Circuit Analysis and Edit9:25 AM-11:25 AM
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Refreshment Break10:15 AM-10:35 AM
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Microscopy and Material Analysis I10:35 AM-12:30 PM
-
Scanning Probe Analysis I11:25 AM-12:30 PM
PM
-
Lunch12:20 PM-1:20 PM
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OFI / TEST / DIAGNOSIS USER GROUP12:30 PM-1:30 PM
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Scanning Probe Analysis II1:40 PM-2:05 PM
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SYSTEM ON PACKAGE USER GROUP1:40 PM-2:40 PM
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Die Level Fault Isolation2:05 PM-3:45 PM
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Microscopy and Material Analysis II2:40 PM-3:05 PM
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Nanoprobing & Electrical Characterization3:05 PM-4:45 PM
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Package Level Fault Isolation3:45 PM-5:00 PM