Technical Program

Sunday, October 30, 2022

7:00 AM-8:00 AM

Monday, October 31, 2022

7:00 AM-8:00 AM

7:45 AM-10:00 AM

10:00 AM-10:20 AM

10:20 AM-12:10 PM


Emerging FA Techniques and Concepts
Session Chair: Mr. Kah Chin Cheong and Dr. Baohua Niu

12:10 PM-1:10 PM


Sample Preparation User Group
Session Chair: Mr. Jim Colvin, Dr. Nathan Bakken, PhD, Dr. Cecile S. Bonifacio and Mr. Kah Chin Cheong

1:00 PM-1:20 PM

1:20 PM-2:20 PM


FIB USER GROUP
Session Chair: Ms. Valerie Brogden, Mr. Steven B. Herschbein, Mr. Michael Wong and Dr. E.L. Principe

2:20 PM-3:55 PM


Hardware Attacks, Security and Reverse Engineering
Session Chair: Mr. Kevin Awai and Dr. Mike Bruce

2:20 PM-5:10 PM


FIB Sample Preparation
Session Chair: Mr. Antonio Tollis and Ms. Valerie Brogden

3:55 PM-5:10 PM


Board and System Level FA
Session Chair: Mr. John Bescup and Mr. Jason Wheeler

5:20 PM-6:30 PM

6:30 PM-9:30 PM

Tuesday, November 1, 2022

7:00 AM-8:00 AM

8:30 AM-9:30 AM

9:30 AM-10:10 AM

9:30 AM-6:30 PM

10:10 AM-12:10 PM


Standardized and AI Enhanced FA Workflows
Session Chair: Dr. Thomas Schweinboeck

12:10 PM-1:10 PM

1:10 PM-4:10 PM


AI Application for FA
Session Chair: Dr. Sebastian Brand and Dr. Daminda Dahanayaka

Case Studies: FA Processes
Session Chair: Dr. Wentao Qin and Dr. Juntao Li

2:50 PM-3:20 PM

4:10 PM-5:00 PM


Product Yield, Test and Diagnostics
Session Chair: Mr. Jayant D'Souza and Mr. David Pivin

Sample Preparation and Device Deprocessing
Session Chair: Dr. Peng Li and Dr. Christopher H. Kang

5:00 PM-6:30 PM

Wednesday, November 2, 2022

7:00 AM-8:00 AM

8:00 AM-9:35 AM

9:30 AM-10:00 AM

9:30 AM-4:00 PM

9:35 AM-10:00 AM


Invited Talk: Si Photonics - George Tzintzarov, Aero
Session Chair: Ms. Pamela Calica

9:35 AM-11:40 AM


Packaging and Assembly Level FA
Session Chair: Mr. Sherwin Tang and Mrs. Sarah Wozny

10:00 AM-11:40 AM


Case Studies: Device Analysis
Session Chair: Mr. Gregory Johnson and Yuyan Wang

11:40 AM-1:10 PM

1:10 PM-1:20 PM

1:20 PM-2:50 PM

2:50 PM-4:00 PM

Thursday, November 3, 2022

7:00 AM-8:00 AM

8:00 AM-9:00 AM


NANO/SCANNING PROBE USER GROUP
Session Chair: Greg Johnson and Mr. Nicholas Antoniou

8:35 AM-9:00 AM

9:00 AM-9:25 AM

9:00 AM-10:35 AM


SiP and 3D Devices Failure Analysis
Session Chair: Dr. William Lo and Dr. Eckhard Langer

9:25 AM-11:25 AM


FIB Circuit Analysis and Edit
Session Chair: Ms. Rose Ring and Dr. Alex Buxbaum

10:15 AM-10:35 AM

10:35 AM-12:30 PM


Microscopy and Material Analysis I
Session Chair: Dr. Wenbing Yun, PhD and Mr. Curtis Schreck

11:25 AM-12:30 PM


Scanning Probe Analysis I
Session Chair: Mr. Paiboon Tangyunyang and Mr. Phil Kaszuba

12:20 PM-1:20 PM

12:30 PM-1:30 PM


OFI / TEST / DIAGNOSIS USER GROUP
Session Chair: Mr. Dan Bockelman and Mr. Neel Leslie

1:40 PM-2:05 PM


Scanning Probe Analysis II
Session Chair: Mr. Paiboon Tangyunyang and Mr. Phil Kaszuba

1:40 PM-2:40 PM


SYSTEM ON PACKAGE USER GROUP
Session Chair: Dr. Bryan Tracy, PhD, Dr. Lihong Cao, Mr. Kevin A. Distelhurst, BS/MS Electrical engineering and Dr. Wentao Qin

2:05 PM-3:45 PM


Die Level Fault Isolation
Session Chair: Mr. Dan Bodoh and Ms. Lesly Endrinal

2:40 PM-3:05 PM


Microscopy and Material Analysis II
Session Chair: Dr. Wenbing Yun, PhD and Mr. Curtis Schreck

3:05 PM-4:45 PM


Nanoprobing & Electrical Characterization
Session Chair: Mr. David Albert and Mr. John Sanders

3:45 PM-5:00 PM


Package Level Fault Isolation
Session Chair: Mr. Stephen Fasolino and Dr. Daniel Braun