Ms. Pei Hoon Ong

Failure Analysis Engineer
Infineon Technologies (Malaysia) Sdn Bhd
QM FA
Melaka Malaysia 75350

Papers:

PACKAGING AND ASSEMBLY LEVEL FA: FA Methodology Comparison to Define Potential Root Cause on Lifted Copper Ball Bond
Develop a Time Efficient Method to Enhance the FIB Process on Die Backside Metallization (BSM) Analysis