PACKAGING AND ASSEMBLY LEVEL FA: FA Methodology Comparison to Define Potential Root Cause on Lifted Copper Ball Bond

Wednesday, November 2, 2022
Exhibit Halls A & B (Pasadena Convention Center)
Ms. Pei Hoon Ong , Infineon Technologies (Malaysia) Sdn Bhd, Melaka, Malaysia
Mr. Sze Yee Tan , Infineon Technologies Malaysis Sdn. Bhd, Melaka, Malaysia
Ms. Chea Wee Lo , Infineon Technologies (Malaysia) Sdn Bhd, Melaka, Malaysia

See more of: Exhibitor Dessert Reception, Poster Session and Video Contest
See more of: Technical Program