Package and Physical Analysis Challenges I

Sunday, October 30, 2022: 10:20 AM-1:20 PM

Ballroom A (Pasadena Convention Center)

Ms. Bernice Zee, Advanced Micro Devices (AMD) and Ms. Sarah Wozny, Intel

10:20 AM

Physical Inspection for Hardware Assurance
Dr. Navid Asadi, University of Florida

11:20 AM

Review of Scanning Probe Microscopy methods for Failure Analysis
Dr. Peter De Wolf, Bruker Nano Surfaces & Metrology; Dr. Senli Guo, Bruker Nano Surfaces & Metrology

12:20 PM

Lunch

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